PCB常识.doc_图文

导读:DiffusionLayer扩散层.Digitizing数字化.DihedralAngle双反斜角.DimensionalStability尺度安定性.Diode二极管.DipCoating浸涂法.DipSoldering浸焊法.DIP(DualInlinePackage)双排脚封装体.Dipole偶极,双极.Direct/IndirectStencil直接

PCB常识.doc_图文

Diffusion Layer扩散层.

Digitizing数字化.

Dihedral Angle双反斜角.

Dimensional Stability尺度安定性.

Diode二极管.

Dip Coating浸涂法.

Dip Soldering浸焊法.

DIP(Dual Inline Package)双排脚封装体. Dipole偶极,双极.

Direct / Indirect Stencil直接/间接版膜.

Direct Emulsion直接乳胶.

Direct Plating直接电镀.

Discrete Compenent散装零件.

Discrete Wiring Board散线电路板,复线板. Dish Down碟型下陷.

Dispersant分散剂.

Dissipation Factor散失因素.

Disspation Factor散逸因子.

Disturbed Joint受扰焊点.

Doctor Blade修平刀,刮平刀.

Dog Ear狗耳.

Doping掺杂.

Double Layer双电层.

Double Treated Foil双面处理铜箔.

Drag In / Drag Out带[进/带出.

Drag Soldering拖焊.

Drawbridging吊桥效应.

Drift漂移.

Drill Facet钻尖切削面.

Drill Pointer钻针重磨机.

Drilled Blank已钻孔的裸板.

Dross浮渣.

Drum Side铜箔光面.

Dry Film干膜.

Dual Wave Soldering 双波焊接.

Ductility展性.

Dummy Land假焊垫.

Dummy, Dummying假镀(片).

Durometer橡胶硬度计.

DYCOstrate电浆蚀孔增层法.

Dynamic Flex(FPC)动态软板.

 *****E*****

E-Beam (Electron Beam)电子束.

Eddy Current涡电流.

Edge Spacing板边空地.

Edge-Board Connector板边(金手指)承接器. Edge-Board Contact板边金手指.

Edge-Dip Solderability Test板边焊锡性测试. EDTA乙二胺四乙酸.

Effluent排放物.

E-glass电子级玻璃.

Elastomer弹性体.

Electric Strength(耐)电性强度.

Electrodeposition电镀.

Electro-deposition Photoresist电着光阻, 电泳光阻. Electroforming电铸.

Electroless-Deposition无电镀.

Electrolytic Tough Pitch电解铜..

Electrolytic-Cleaning电解清洗.

Electro-migration电迁移.

Electro-phoresis电泳动, 电渗.

Electro-tinning镀锡.

Electro-Winning电解冶炼.

Elongation 延伸性, 延伸率.

Embossing凸出性压花.

EMF(Electromotive Force)电动势.

EMI(Electromagnetic Interference)电磁干扰. Emulsion乳化.

Emulsion Side药膜面.

Encapsulating胶囊.

Encroachment沾污,侵犯.

End Tap封头.

Entek有机护铜处理.

Entrapment夹杂物.

Entry Material盖板.

Epoxy Resin环氧树脂.

Etch Factor蚀刻因子.

Etchant蚀刻剂(液).

Etchback回蚀.

Etching Indicator蚀刻指针.

Etching Resist蚀刻阻剂.

Eutetic Composition共融组成.

Exotherm放热(曲线).

Exposure曝光.

Eyelet铆眼.

 *****F*****

Fabric纲布.

Face Bonding反面朝下结合.

Failure故障.

Fan Out Wiring/Fan In Wiring扇出布线/扇入布线. Farad 法拉.

Farady法拉第.

Fatigue Strength抗疲劳强度.

Fault缺陷.

Fault Plane断层面.

Feed Through Hole导通孔.

Feeder 进料器.

Fiber Exposure玻纤显露.

Fiducial Mark基准记号.

Filament纤丝.

Fill纬向.

Filler填充料.

Fillet内圆填角.

Film底片.

Film Adhesive接着膜,粘合膜.

Filter过滤器.

Fine Line细线.

Fine Pitch密脚距,密线距,密垫距.

Fineness粒度, 纯度.

Finger手指.

Finishing终修(饰).

Finite Element Method有限要素分析法.

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